12 May 2027 | Osaka, Japan
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International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion... This manufacturing tradeshow takes place in Osaka, Japan from 12-05-2027 to 14-05-2027. It is organized by RX Japan.
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Please,check the "Adhesion & Bonding Expo - Osaka" official website for possible changes, before making any traveling arrangements. |
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| Contact Person | Event Coordinator |
| Organized By | RX Japan |
| Event Enquiries | joining-e@reedexpo.co.jp |
| Visit Website | Organizer's Website Link |
|
Please,check the "Adhesion & Bonding Expo - Osaka" official website for possible changes, before making any traveling arrangements. |
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| Start Date | 12 May 2027 |
| End Date | 14 May 2027 |
| Save | |
| Start Date | 12 May 2027 |
| End Date | 14 May 2027 |
| Save | |
| Event Coordinator |
| +81 (0)3 3349-8501 |
| RX Japan |
| joining-e@reedexpo.co.jp |
| Organizer's Website Link |