12 May 2027 | Osaka, Japan
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Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging... This engineering tradeshow takes place in Osaka, Japan from 12-05-2027 to 14-05-2027. It is organized by RX Japan.
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Please,check the "Ic & Sensor Packaging Expo Japan - Osaka" official website for possible changes, before making any traveling arrangements. |
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| Contact Person | Event Coordinator |
| Organized By | RX Japan |
| Event Enquiries | icp-e@reedexpo.co.jp |
| Visit Website | Organizer's Website Link |
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Please,check the "Ic & Sensor Packaging Expo Japan - Osaka" official website for possible changes, before making any traveling arrangements. |
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| Start Date | 12 May 2027 |
| End Date | 14 May 2027 |
| Save | |
| Start Date | 12 May 2027 |
| End Date | 14 May 2027 |
| Save | |
| Event Coordinator |
| +81 (0)3 3349-8501 |
| RX Japan |
| icp-e@reedexpo.co.jp |
| Organizer's Website Link |