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Ic & Sensor Packaging Expo Japan - Tokyo

21 January 2026   |   Tokyo, Japan

About this event


Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Please,check the "Ic & Sensor Packaging Expo Japan - Tokyo" official website for possible changes, before making any traveling arrangements.

Contact Person Event Coordinator
Organized By Reedexpo
Event Enquiries info@reedexpo.co.jp
Visit Website Organizer's Website Link

Please,check the "Ic & Sensor Packaging Expo Japan - Tokyo" official website for possible changes, before making any traveling arrangements.

Start Date 21 January 2026
End Date 23 January 2026
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Important dates 🗓️

Start Date 21 January 2026
End Date 23 January 2026
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Organizer details

Event Coordinator
+81 (0)3 3349-8501
Reedexpo
info@reedexpo.co.jp
Organizer's Website Link

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